{"id":42455,"date":"2026-05-26T09:55:00","date_gmt":"2026-05-26T07:55:00","guid":{"rendered":"https:\/\/www.cloudmagazin.com\/2026\/05\/27\/computex-2026-huang-tsmc-su-amd-10-milliarden-packaging\/"},"modified":"2026-11-03T17:30:59","modified_gmt":"2026-11-03T16:30:59","slug":"computex-2026-huang-tsmc-su-amd-10-milliarden-packaging","status":"publish","type":"post","link":"https:\/\/www.cloudmagazin.com\/fr\/2026\/05\/26\/computex-2026-huang-tsmc-su-amd-10-milliarden-packaging\/","title":{"rendered":"Avant le Computex : AMD \u00e9tend son packaging \u00e0 Ta\u00efwan"},"content":{"rendered":"<p><strong>AMD veut d\u00e9velopper ses partenariats dans l&rsquo;\u00e9cosyst\u00e8me ta\u00efwanais des semi-conducteurs et soutenir des capacit\u00e9s suppl\u00e9mentaires pour l&rsquo;advanced packaging. Quelques jours apr\u00e8s cette annonce, le dirigeant de Nvidia, Jensen Huang, a rencontr\u00e9 \u00e0 Taipei le dirigeant de TSMC, C.C. Wei. Nvidia a ensuite annonc\u00e9 la mont\u00e9e en production de sa plateforme Vera Rubin. Pour les \u00e9quipes cloud, les dates de livraison concr\u00e8tes, la disponibilit\u00e9 r\u00e9gionale et l&rsquo;ad\u00e9quation du stack logiciel restent d\u00e9cisives.<\/strong><\/p>\n<h2>L&rsquo;essentiel en bref<\/h2>\n<div style=\"background:#f8fbfd;border:1px solid rgba(11,183,253,0.28);border-radius:8px;padding:22px 26px;margin:16px 0 34px;box-shadow:0 1px 0 rgba(11,183,253,0.08),0 2px 8px rgba(0,0,0,0.03);\">\n<ul style=\"margin:0;padding-left:20px;line-height:1.75;color:#1a2733;\">\n<li style=\"margin-bottom:10px;\"><strong>AMD \u00e9largit sa collaboration avec ses partenaires de packaging ta\u00efwanais.<\/strong> ASE et SPIL travaillent avec AMD sur une technologie d&rsquo;interconnexion EFB sur wafer, PTI sur une variante sur panel.<\/li>\n<li style=\"margin-bottom:10px;\"><strong>Nvidia a annonc\u00e9 la mont\u00e9e en production de Vera Rubin.<\/strong> Fin mai, l&rsquo;entreprise a \u00e9voqu\u00e9 des livraisons de production \u00e0 partir de l&rsquo;automne 2026.<\/li>\n<li><strong>Les plans d&rsquo;investissement ne d\u00e9bouchent pas sur des capacit\u00e9s cloud concr\u00e8tes.<\/strong> Les entreprises devraient examiner les offres selon la r\u00e9gion, la date de livraison, la compatibilit\u00e9 logicielle et les co\u00fbts.<\/li>\n<\/ul>\n<\/div>\n<h2>AMD \u00e9largit son \u00e9cosyst\u00e8me de packaging<\/h2>\n<p>Le 21 mai 2026, AMD a annonc\u00e9 des investissements dans son \u00e9cosyst\u00e8me ta\u00efwanais. La <a href=\"https:\/\/ir.amd.com\/news-events\/press-releases\/detail\/1286\/amd-announces-more-than-10-billion-in-taiwan-ecosystem-investments-to-accelerate-ai-infrastructure\" style=\"color:#0879aa;text-decoration:underline;text-decoration-thickness:1px;text-underline-offset:3px;\">communication de l&rsquo;entreprise<\/a> d\u00e9crit l&rsquo;extension des partenariats strat\u00e9giques et de l&rsquo;advanced packaging pour une future infrastructure d&rsquo;IA. Elle ne chiffre pas la part de l&rsquo;investissement total revenant uniquement au packaging.<\/p>\n<p>Avec ASE et SPIL, AMD d\u00e9veloppe et qualifie, selon ses propres d\u00e9clarations, une technologie d&rsquo;interconnexion 2,5D sur wafer baptis\u00e9e Elevated Fanout Bridge, en abr\u00e9g\u00e9 EFB. AMD cite comme domaine d&rsquo;application les futurs processeurs EPYC portant le nom de code Venice. Avec PTI, l&rsquo;entreprise a par ailleurs qualifi\u00e9, selon ses propres d\u00e9clarations, une interconnexion EFB sur panel.<\/p>\n<p>L&rsquo;advanced packaging r\u00e9unit plusieurs composants semi-conducteurs en une seule unit\u00e9. Pour les achats, il importe de savoir quels produits utilisent r\u00e9ellement une technologie et quand il en r\u00e9sultera des syst\u00e8mes livrables. L&rsquo;annonce seule ne d\u00e9montre ni des capacit\u00e9s GPU disponibles ni un all\u00e8gement pr\u00e9cis chez TSMC.<\/p>\n<h2>Nvidia passe Vera Rubin en production<\/h2>\n<p>Avant le Computex, Huang a rencontr\u00e9 le 26 mai \u00e0 Taipei le dirigeant de TSMC, C.C. Wei, lors d&rsquo;un d\u00eener commun. Le <a href=\"https:\/\/blogs.nvidia.com\/blog\/nvidia-gtc-taipei-computex-2026-news\/\" style=\"color:#0879aa;text-decoration:underline;text-decoration-thickness:1px;text-underline-offset:3px;\">compte rendu de Nvidia sur cette rencontre<\/a> ne mentionne aucun accord concret sur la capacit\u00e9 de production.<\/p>\n<p>Le 31 mai, Nvidia a annonc\u00e9 le <a href=\"https:\/\/nvidianews.nvidia.com\/news\/vera-rubin-full-production-agentic-ai-factory\" style=\"color:#0879aa;text-decoration:underline;text-decoration-thickness:1px;text-underline-offset:3px;\">passage de Vera Rubin en production en s\u00e9rie<\/a>. Selon la communication de l&rsquo;\u00e9poque, les livraisons de production devaient commencer \u00e0 partir de l&rsquo;automne 2026. Il s&rsquo;agit d&rsquo;un calendrier annonc\u00e9 par le fabricant, qui en soi ne confirme ni une livraison effectu\u00e9e ni des instances r\u00e9servables dans une r\u00e9gion europ\u00e9enne donn\u00e9e.<\/p>\n<h2>Ce que les \u00e9quipes cloud devraient v\u00e9rifier lors de l&rsquo;achat<\/h2>\n<p>Un deuxi\u00e8me fournisseur peut \u00e9largir les options d&rsquo;achat, \u00e0 condition que les applications et le mod\u00e8le d&rsquo;exploitation s&rsquo;y pr\u00eatent. Pour cela, les \u00e9quipes devraient tester leur stack d&rsquo;inf\u00e9rence ou d&rsquo;entra\u00eenement sur le mat\u00e9riel propos\u00e9 par chaque offre. Sont notamment \u00e0 examiner la prise en charge des mod\u00e8les, les frameworks utilis\u00e9s, les pilotes, l&rsquo;environnement d&rsquo;ex\u00e9cution et l&rsquo;effort requis pour l&rsquo;exploitation.<\/p>\n<p>AMD pr\u00e9sente <a href=\"https:\/\/www.amd.com\/en\/products\/rackscale-solutions\/helios.html\" style=\"color:#0879aa;text-decoration:underline;text-decoration-thickness:1px;text-underline-offset:3px;\">Helios comme un design de r\u00e9f\u00e9rence<\/a> sur la base duquel des partenaires peuvent construire leurs propres syst\u00e8mes. AMD mentionne comme perspective des d\u00e9ploiements en volume au second semestre 2026. La disponibilit\u00e9 d&rsquo;une offre concr\u00e8te et son \u00e9ch\u00e9ance d\u00e9pendent du fournisseur et du site concern\u00e9s.<\/p>\n<p>Pour une comparaison solide, les performances de son propre workload doivent figurer aux c\u00f4t\u00e9s du prix, de la dur\u00e9e du contrat et de la date de mise \u00e0 disposition promise. Pour les offres cloud, il faut en outre clarifier la r\u00e9gion, les conditions de r\u00e9servation et la capacit\u00e9 r\u00e9ellement exploitable. Les annonces des fabricants ne permettent pas de tirer de conclusions g\u00e9n\u00e9rales sur des prix en hausse ou des d\u00e9lais de livraison garantis.<\/p>\n<h2 style=\"padding-top:64px;margin-bottom:20px;\">Questions fr\u00e9quentes<\/h2>\n<details>\n<summary><strong>Que signifie l&rsquo;annonce d&rsquo;AMD pour les livraisons de GPU ?<\/strong><\/summary>\n<p style=\"margin:8px 0 4px 24px;color:#555;line-height:1.6;\">AMD veut \u00e9tendre ses partenariats et ses capacit\u00e9s de packaging. L&rsquo;annonce ne mentionne aucun volume de livraison ni aucun d\u00e9lai contraignants pour des r\u00e9gions cloud pr\u00e9cises.<\/p>\n<\/details>\n<details>\n<summary><strong>Vera Rubin est-il disponible dans une r\u00e9gion cloud DACH ?<\/strong><\/summary>\n<p style=\"margin:8px 0 4px 24px;color:#555;line-height:1.6;\">La communication de Nvidia du 31 mai \u00e9voquait des livraisons de production \u00e0 partir de l&rsquo;automne 2026. Elle ne confirme aucune possibilit\u00e9 de r\u00e9servation dans une r\u00e9gion DACH pr\u00e9cise. Les entreprises doivent demander le calendrier actuel au fournisseur concern\u00e9.<\/p>\n<\/details>\n<details>\n<summary><strong>Que devraient tester les \u00e9quipes avant un changement de plateforme GPU ?<\/strong><\/summary>\n<p style=\"margin:8px 0 4px 24px;color:#555;line-height:1.6;\">Les mod\u00e8les et applications propres \u00e0 l&rsquo;entreprise sont d\u00e9terminants. Un test devrait couvrir la compatibilit\u00e9 logicielle, les performances, les co\u00fbts d&rsquo;exploitation et la capacit\u00e9 disponible dans le p\u00e9rim\u00e8tre de d\u00e9ploiement pr\u00e9vu.<\/p>\n<\/details>\n<aside data-element=\"sources\">\n<details class=\"evm-sources\">\n<summary>Sources et \u00e9tat des informations <span class=\"evm-sources-count\">(4)<\/span><\/summary>\n<ul>\n<li><a href=\"https:\/\/ir.amd.com\/news-events\/press-releases\/detail\/1286\/amd-announces-more-than-10-billion-in-taiwan-ecosystem-investments-to-accelerate-ai-infrastructure\" rel=\"noopener\" target=\"_blank\">AMD : investissements dans l&rsquo;\u00e9cosyst\u00e8me ta\u00efwanais, mai 2026<\/a><\/li>\n<li><a href=\"https:\/\/blogs.nvidia.com\/blog\/nvidia-gtc-taipei-computex-2026-news\/\" rel=\"noopener\" target=\"_blank\">Nvidia : GTC Taipei et Computex, mai et juin 2026<\/a><\/li>\n<li><a href=\"https:\/\/nvidianews.nvidia.com\/news\/vera-rubin-full-production-agentic-ai-factory\" rel=\"noopener\" target=\"_blank\">Nvidia : Vera Rubin en mont\u00e9e en production, mai 2026<\/a><\/li>\n<li><a href=\"https:\/\/www.amd.com\/en\/products\/rackscale-solutions\/helios.html\" rel=\"noopener\" target=\"_blank\">AMD : Helios Rackscale Solution<\/a><\/li>\n<\/ul>\n<\/details>\n<\/aside>\n<h2>S\u00e9lection de la r\u00e9daction<\/h2>\n<ul style=\"list-style:none;margin:0 0 8px;padding:0;\">\n<li style=\"padding:10px 0;border-bottom:1px solid #eee;\"><a href=\"https:\/\/www.cloudmagazin.com\/fr\/2026\/05\/22\/aws-nvidia-blackwell-rubin-million-gpus-platform-engineering\/\" style=\"color:#1a1a1a;text-decoration:none;\">AWS et Nvidia : un million de GPU contraint les \u00e9quipes plateforme<\/a><\/li>\n<li style=\"padding:10px 0;border-bottom:1px solid #eee;\"><a href=\"https:\/\/www.cloudmagazin.com\/fr\/2026\/05\/20\/finops-pour-linference-de-lia-les-couts-des-gpu-dans-le-multi-cloud-maitrises\/\" style=\"color:#1a1a1a;text-decoration:none;\">FinOps pour l&rsquo;inf\u00e9rence d&rsquo;IA<\/a><\/li>\n<li style=\"padding:10px 0;\"><a href=\"https:\/\/www.cloudmagazin.com\/fr\/2026\/05\/16\/cout-d-inference-gpu-pour-finops-2026\/\" style=\"color:#1a1a1a;text-decoration:none;\">Le playbook de l&rsquo;inf\u00e9rence<\/a><\/li>\n<\/ul>\n<h2>Plus du r\u00e9seau MBF Media<\/h2>\n<ul style=\"list-style:none;margin:0 0 8px;padding:0;\">\n<li style=\"padding:10px 0;border-bottom:1px solid #eee;\"><a href=\"https:\/\/mybusinessfuture.com\/fr\/quand-la-productivite-par-lia-devient-couteuse\/\" style=\"color:#1a1a1a;text-decoration:none;\">Quand la productivit\u00e9 dop\u00e9e \u00e0 l&rsquo;IA devient ch\u00e8re : ce que co\u00fbte la consolidation des outils<\/a><\/li>\n<li style=\"padding:10px 0;border-bottom:1px solid #eee;\"><a href=\"https:\/\/www.digital-chiefs.de\/fr\/microsoft-ai-arr-37-milliarden-q1-2026-dach-cio-budget\/\" style=\"color:#1a1a1a;text-decoration:none;\">ARR IA de Microsoft d&rsquo;environ 34 milliards d&rsquo;euros : ce que les chiffres du T1 signifient pour les budgets des DSI du DACH<\/a><\/li>\n<li style=\"padding:10px 0;\"><a href=\"https:\/\/www.securitytoday.de\/fr\/2026\/05\/25\/trapdoor-attaque-coordonnee-sur-la-chaine-dapprovisionnement-contre-npm-pypi-et\/\" style=\"color:#1a1a1a;text-decoration:none;\">TrapDoor : attaque coordonn\u00e9e de la supply chain contre npm, PyPI et Crates<\/a><\/li>\n<\/ul>\n<p style=\"text-align:right;color:#868e96;font-size:0.75em;margin-top:40px;\"><em>Source de l\u2019image : g\u00e9n\u00e9r\u00e9e par IA (juin 2026)<\/em><\/p>\n","protected":false},"excerpt":{"rendered":"AMD \u00e9tend ses partenariats de packaging \u00e0 Ta\u00efwan. Ce que signifient pour les \u00e9quipes cloud l&rsquo;annonce et la mont\u00e9e en production de Vera Rubin chez Nvidia.","protected":false},"author":31,"featured_media":43307,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_yoast_wpseo_meta-robots-noindex":"","_yoast_wpseo_meta-robots-nofollow":"","_yoast_wpseo_meta-robots-adv":"","_yoast_wpseo_canonical":"","_yoast_wpseo_opengraph-title":"","_yoast_wpseo_opengraph-description":"","_yoast_wpseo_opengraph-image":"","_yoast_wpseo_opengraph-image-id":0,"_yoast_wpseo_twitter-title":"","_yoast_wpseo_twitter-description":"","_yoast_wpseo_twitter-image":"","_yoast_wpseo_twitter-image-id":0,"pre_headline":"","bildquelle":"","teasertext":"","language":"de","_evm_slot_owner":"","_evm_translation_lang":"","featured_post":0,"featured_post_sortierung":0,"_wp_old_slug":[],"footnotes":""},"categories":[934,944,937],"tags":[],"industry":[],"class_list":["post-42455","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-actualites","category-centres-de-donnees","category-intelligence-artificielle"],"evm_reading_time_minutes":5,"wpml_language":"fr","wpml_translation_of":42348,"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Avant le Computex : AMD \u00e9tend son packaging \u00e0 Ta\u00efwan<\/title>\n<meta name=\"description\" content=\"AMD \u00e9tend ses partenariats de packaging \u00e0 Ta\u00efwan, Nvidia annonce le d\u00e9marrage de production de Vera Rubin. 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